Detailed explanation of 2010 chip resistor package size diagram

Release time: 2025-02-16 Editor:admin Reading volume:0Second-rate

With the continuous miniaturization and high performance of electronic products,Chip resistorAs an important part of electronic components, its package size has become a parameter that must be paid attention to during the design and procurement process. 2010 patchresistanceBecause of its moderate size and high power, it is widely used in various electronic circuits. This article will introduce in detail the package size diagram of the 2010 chip resistor to help engineers and purchasers better understand and apply this type of resistor.

1. Basic size specifications of chip resistors in 2010

The name of the 2010 chip resistor comes from its size. 2010 means that its package size is 2.0mm×1.0mm. Specifically, the 2010 package is 2.0mm long and 1.0mm wide. This size design takes into account both volume and heat dissipation performance, and is suitable for medium-power circuit needs.

2. Package thickness and its importance

In addition to length and width, the thickness of 2010 chip resistors is also very critical. Standard thickness is generally between 0.55mm and 0.60mm. The thickness affects the power carrying capacity and heat dissipation efficiency of the resistor. When designing, a resistor with an appropriate thickness must be selected according to the actual needs of the circuit.

3. Electrode size and spacing

The electrode size of 2010 chip resistors is usually 0.5mm×1.0mm, and the spacing between electrodes is 1.0mm. The size and spacing of electrodes are directly related to the reliability and electrical performance of welding. Reasonable design can effectively prevent short circuit and virtual welding problems.

4. Power levels of chip resistors in 2010

The general power level of chip resistors in this package size is 0.5W. The larger power allows it to bear more loads in the circuit, making it suitable for use in circuit parts with higher power. When selecting, reasonable configuration should be based on actual power requirements to avoid overloading.

5. 2010 marking method of package resistors

In order to facilitate identification, 2010 chip resistors usually use three or four digits to identify the resistance value. For example, "103" means 10kΩ, and "1002" means 10kΩ. Understanding the marking specifications will help you quickly and accurately select the required resistor.

6. Application scope of chip resistors in 2010

Due to its moderate size and moderate power, 2010 chip resistors are widely used in power modules, signal processing circuits, industrial control, and automotive electronics. Its stability and reliability make it one of the most commonly used components among designers.

7. How to obtain the 2010 chip resistor package size diagram

Package dimensional drawings are generally provided by the manufacturer and usually contain detailed dimensioning and tolerance ranges. Engineers can download it from the official website, component manuals or professional electronic component databases to ensure the accuracy of the design.

8. The impact of package size on PCB design

The size of the 2010 chip resistor directly affects PCB layout and wiring. Reasonable size selection can improve the space utilization and electrical performance of the PCB. It also facilitates the operation of automated placement equipment and improves production efficiency.

2010 Chip resistors have become an indispensable component in electronic design due to their unique size advantages and moderate power levels. Mastering its package size diagram not only helps in accurate design, but also improves product reliability and production efficiency. This article provides a comprehensive reference for electronic engineers by introducing in detail the core contents such as size specifications, electrode parameters, and power levels of 2010 chip resistors. In the future, with the development of electronic technology, reasonable selection and application of 2010 package resistors will continue to help the innovation and upgrading of electronic products.